Research and Markets (http://www.researchandmarkets.com/research/8f3pg7/system_on_package)
has announced the addition of the "System
On Package (SOP) Market - By Technology Elements (Electrical Silicon
Through-Vias, Fine Pitch, High Bandwidth Wiring And Others), By
Application (Consumers Electronics, Wireless Communication) And By
Geography (2015-2020)" report to their offering.
SOP (System On Package) is a technology that places an entire system
with computing, communications, and consumer functions all in a single
chip. This technology is forecast to enable lower cost, more efficient
and higher performance electronic systems. SOP saves interconnection
time and heat generation by keep a full system with computing,
communications, and consumer functions all in a single chip.
SOP report categorizes the market into three different segments, namely,
market by type of technology elements, application, and geography. Based
on the technology elements, the market has been classified into
Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring,
Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and
Advanced Microchannel Cooling. The applications include Consumer
electronics and wireless communications. Based on the geography, the
report has been segmented into North America, Europe, APAC, and RoW.
Key Topics Covered:
1. Global SOP (SOP) Market - Market Overview
2. Executive Summary
3. Global SOP Market - Market Landscape
4. Global SOP Market - Strategic Analysis
5. Global SOP Market - by Technology Elements
6. Global SOP Market - by Application
7. Global SOP Market- By Geography
8. Global SOP - Market Entropy
9. Company Profiles (Overview, Financials, SWOT Analysis, Developments,
Rockwell Automation, Inc.
Honeywell International Inc.
Cooper Industries plc
Emerson Electric Co.
Hollysys Automation Technologies Ltd
Thomas & Betts Corporation
NHP Electrical Engineering Products
E2S Warning Signals
WERMA SIGNALTECHNIK GMBH + CO.KG
JAuer Signalgerate GmbH
For more information visit http://www.researchandmarkets.com/research/8f3pg7/system_on_package
View source version on businesswire.com: http://www.businesswire.com/news/home/20150812005449/en/
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