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Research and Markets: Global System On Package (SOP) Market 2015-2020 - By Technology Elements by Application and by Geography

2015-08-12 17:44:27 来源:
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  Research and Markets (http://www.researchandmarkets.com/research/8f3pg7/system_on_package)

  has announced the addition of the "System

  On Package (SOP) Market - By Technology Elements (Electrical Silicon

  Through-Vias, Fine Pitch, High Bandwidth Wiring And Others), By

  Application (Consumers Electronics, Wireless Communication) And By

  Geography (2015-2020)" report to their offering.

  SOP (System On Package) is a technology that places an entire system

  with computing, communications, and consumer functions all in a single

  chip. This technology is forecast to enable lower cost, more efficient

  and higher performance electronic systems. SOP saves interconnection

  time and heat generation by keep a full system with computing,

  communications, and consumer functions all in a single chip.

  SOP report categorizes the market into three different segments, namely,

  market by type of technology elements, application, and geography. Based

  on the technology elements, the market has been classified into

  Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring,

  Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and

  Advanced Microchannel Cooling. The applications include Consumer

  electronics and wireless communications. Based on the geography, the

  report has been segmented into North America, Europe, APAC, and RoW.

  Key Topics Covered:

  1. Global SOP (SOP) Market - Market Overview

  2. Executive Summary

  3. Global SOP Market - Market Landscape

  4. Global SOP Market - Strategic Analysis

  5. Global SOP Market - by Technology Elements

  6. Global SOP Market - by Application

  7. Global SOP Market- By Geography

  8. Global SOP - Market Entropy

  9. Company Profiles (Overview, Financials, SWOT Analysis, Developments,

  Product Portfolio)

  10. Appendix

  Companies Mentioned



  •   

IBM Corporation





  •   

ABB Ltd.





  •   

Rockwell Automation, Inc.





  •   

Honeywell International Inc.





  •   

Cooper Industries plc





  •   

Emerson Electric Co.





  •   

Hollysys Automation Technologies Ltd





  •   

Thomas & Betts Corporation





  •   

Thales Group





  •   

RSTAHL, Inc.





  •   

NHP Electrical Engineering Products





  •   

E2S Warning Signals





  •   

WERMA SIGNALTECHNIK GMBH + CO.KG





  •   

JAuer Signalgerate GmbH





  •   

For more information visit http://www.researchandmarkets.com/research/8f3pg7/system_on_package

  View source version on businesswire.com: http://www.businesswire.com/news/home/20150812005449/en/

  Research and Markets

  Laura Wood, Senior Manager

  press@researchandmarkets.com

  For

  E.S.T Office Hours Call 1-917-300-0470

  For U.S./CAN Toll Free Call

  1-800-526-8630

  For GMT Office Hours Call +353-1-416-8900

  U.S.

  Fax: 646-607-1907

  Fax (outside U.S.): +353-1-481-1716

  Sector: Computing

  and Technology

  Copyright Business Wire 2015

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